| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor package which has an approximately flat surface, enables the reduction of a cycle time and enables the reduction of the assembly cost. SOLUTION: A semiconductor package board 10 has arrays of approximately identical package sites 13, 14, 16, 21, 22 and 23. All the arrays of the package sites 13, 14, 16, 21, 22 and 23 are covered with sealing material 19. By cutting the sealing material 19 and the semiconductor package board 10 under the sealing material 19, the individual package sites 13, 14, 16, 21, 22 and 23 can be obtained discretely.</p> |
