发明名称 Punctual glueing process for support containing plant seeds
摘要 The procedure consists of applying an adhesive (4) to one layer (3) of biodegradable or water-degradable paper, film or substrate in small spots (4) less than 1 mm in diameter. The spots are spaced as far apart as possible commensurate with the quality of the layer material so that the two layers are held firmly together but with little statistical chance of any seed having its germination point covered with adhesive.
申请公布号 EP0953279(A1) 申请公布日期 1999.11.03
申请号 EP19990460030 申请日期 1999.04.28
申请人 COUDRIEAU, JOEL;LANCHIER, JEAN-MARC 发明人 COUDRIEAU, JOEL;LANCHIER, JEAN-MARC
分类号 A01C1/04;(IPC1-7):A01C1/04 主分类号 A01C1/04
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