Lightweight ready-mix joint compound for coating and filling gypsum board joints

摘要

The joint compound for filling and coating the joints between adjacent panels of gypsum wallboards is disclosed wherein the joint compound comprises a binder, and one or more fillers, where at least one of the fillers comprises hollow resin microspheres with a mean particle size of less than 75 microns and exhibiting no more than 1.5% increase in density under high shear stress testing