Electronic component, method for making the same, and lead frame and mold assembly for use therein

摘要

A method of fabricating a plurality of electronic components of a resin molded package type, said method comprising: over a plate-like lead frame comprising a plurality of bridge parts which are formed into a lattice and a plurality of sets of lead parts which extend towards a plurality of lattice open spaces which are horizontally and perpendicularly, and two-dimensionally defined by said plurality of bridge parts, a step of fixing each of a plurality of electronic elements in a corresponding lattice open space of said plurality of lattice open spaces.