| 发明名称 |
Process for treating a conductive surface and products formed thereby |
| 摘要 |
The disclosure relates to a process for forming a deposit on the surface of a metallic or conductive surface. The process employs an electrolytic process to deposit a silicate containing coating or film upon a metallic or conductive surface.
|
| 申请公布号 |
US6911139(B2) |
申请公布日期 |
2005.06.28 |
| 申请号 |
US20020211094 |
申请日期 |
2002.08.02 |
| 申请人 |
ELISHA HOLDING LLC |
发明人 |
HEIMANN ROBERT L.;POPOV BRANKO;FLINT BRUCE;HEIMANN NANCY G.;CHANDRAN RAVI;DALTON WILLIAM M. |
| 分类号 |
C25D9/08;(IPC1-7):C25D9/00;B32B15/04 |
主分类号 |
C25D9/08 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
