Module with an electronic component electrically connected between two substrates, in particular DCB ceramic substrates, and production method thereof

摘要

The module (1) has an unpackaged electronic component e.g. diode (2), with a connecting surface (3) arranged on an upper side or a lower side of an electrical contacting and/or attachment. The component is positioned between lower and upper substrates i.e. direct copper bonded ceramic substrates (5a, 5b), such that the connecting surface provides an electrical contact and/or an attachment with an electrical conductor (7) and/or an attachment surface on the substrates, where a surface of the electrical conductor and/or attachment lies opposite to the connecting surface. An independent claim is also included for a method for manufacturing a module.