| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring substrate enhancing electrical connection reliability between a through electrode and a wiring part by relaxing a stress concentration to directly underneath a side wall of a via hole and by reducing a stress to the side wall of the via hole in a wiring substrate equipped with the through electrode. SOLUTION: This wiring substrate 10 includes at least: a first conductive part 13 provided on one face 11a of a substrate 11; a via hole 14 provided within the substrate so that at least a part of the first conductive part is exposed from another face 11b of the substrate; and a second conductive part 15 extended for covering the exposed first conductive part and the side wall in the via hole and for covering another face of the substrate and electrically connected with the first conductive part. The side wall of the via hole has multiple faces in the depth direction thereof and at the bottom part of the via hole, the part of the second conductive part connected with the first conductive part has larger thickness than those of other parts. COPYRIGHT: (C)2009,JPO&INPIT |
