| 摘要 |
This technology pertains to: a semiconductor device capable of preventing the occurrence of flaring and interference caused by a bonding jig, improving impedance properties, and reducing device size; a solid-state imaging element; an imaging device; and an electronic device. By aligning the heights of cover glass and a semiconductor element and minimizing the distance between the cover glass and the semiconductor element, it is possible to suppress the occurrence of flaring caused by incident light reflected by a lateral surface of the semiconductor element, and to improve impedance properties between the semiconductor element and a semiconductor imaging element. In addition, it is possible to reduce interference from a jig used in the semiconductor element. This technology is applicable to CMOS image sensors. |
