Semiconductor package with embedded die

摘要

A semiconductor package having an embedded die and solid vertical interconnections, such as stud bump interconnections, for increased integration in the direction of the z-axis (i.e., in a direction normal to the circuit side of the die). The semiconductor package can include a die mounted in a face-up configuration (similar to a wire bond package) or in a face-down or flip chip configuration.

主权项

1. A method of making a semiconductor device, comprising:
providing a semiconductor die; forming a conductive layer in a peripheral region around the semiconductor die; and forming a first stud bump over the conductive layer by pressing a wire over the conductive layer under temperature to flatten an end of the wire and form an enlarged base portion covering a top surface and side surface of the conductive layer.