发明名称 PLATING APPARATUS
摘要 PROBLEM TO BE SOLVED: To stably obtain a plating film which can selectively remove an organic compound which causes defects in a plating solution, without reducing density of a useful additive, and in which haze or projection is not generated for a long period.SOLUTION: A plating device comprises: a plating tank; and an impurity removal mechanism which is connected so as to remove impurities from a plating solution in the plating tank or a plating solution which is supplied to the plating tank. The impurity removal mechanism comprises at least one of a carboxylic acid removal mechanism and an alcohol removal mechanism.SELECTED DRAWING: Figure 1
申请公布号 JP2016130363(A) 申请公布日期 2016.07.21
申请号 JP20150254508 申请日期 2015.12.25
申请人 TDK CORP 发明人 SUZUKI MASANORI;OTA HISASHI
分类号 C25D21/22 主分类号 C25D21/22
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