| 摘要 |
A thermoconductive electroconductive adhesive composition including an electroconductive filler (A), an epoxy resin (B), a curing agent (C), and an organic solvent (D), the electroconductive filler (A) being a submicron silver fine powder, the mass ratio of the blended amount of the electroconductive filler (A) and the blended amount of the epoxy resin (B) being (A)/(B) = 96.0/4.0 to 99.5/0.5, the epoxy resin (B) including at least a bisphenol-type epoxy resin and a novolak-type epoxy resin, the curing agent (C) being diaminodiphenyl sulfone and/or a derivative thereof, and the blended amount of the curing agent (C) being 0.4-2.4 mol equivalents in terms of active hydrogen equivalents with respect to 1 mol equivalent of epoxy groups of the epoxy resin (B). Provided is a thermoconductive electroconductive adhesive composition used as a die bonding material, the thermoconductive electroconductive adhesive composition having high heat dissipation and stable electroconductive properties, and exhibiting high adhesive force. |
