PRESSURE-SENSITIVE ADHESIVE COMPOSITION

摘要

The present invention relates to an adhesive composition, an encapsulation film including the same, an organic electronic device including the same, and a method for producing the organic electronic device. More specifically, provided is an adhesive composition which can have a structure capable of effectively blocking oxygen or moisture introduced into the organic electronic device from the outside. In addition, the adhesive composition also shows excellent processability during a panel production process as well as superior heat-resistant retainability under a condition involving a high temperature and high humidity.