This disclosure relates to an etching composition containing about 60% to about 95% of at least one sulfonic acid; about 0.005% to about 0.04% of chloride anion; about 0.03% to about 0.27% of bromide anion; about 0.1% to about 20% of nitrate or nitrosyl ion; and about 3% to about 37% of water.
申请公布号
EP2807289(B1)
申请公布日期
2016.09.21
申请号
EP20130834612
申请日期
2013.07.31
申请人
FUJIFILM ELECTRONIC MATERIALS USA, INC.;FUJIFILM CORPORATION
