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发明名称
电浆蚀刻方法
摘要
本发明目的在于提供一种可同时满足对沟槽形状之要求及对高深宽比之要求,且可形成具有平滑形状之侧壁之沟槽的电浆蚀刻方法,该方法系将矽基板载置于下部电极上,并透过气体导入口供给蚀刻气体,自排气口排气,并由高频电源分别供给高频电力至上部电极及下部电极,以藉ICP法使前述蚀刻气体电浆化而产生活性种来对矽基板施行蚀刻,且蚀刻气体是使用以SF6气体为主成分,且除此再添加O2气体及He气体的混合气体。
申请公布号
TW200524037
申请公布日期
2005.07.16
申请号
TW093136848
申请日期
2004.11.30
申请人
松下电器产业股份有限公司
发明人
奥根充弘;广岛满;铃木宏之;三宅清郎;渡边彰三
分类号
H01L21/3065
主分类号
H01L21/3065
代理机构
代理人
恽轶群;陈文郎
主权项
地址
日本
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