| 摘要 |
PURPOSE:To reduce heat resistance at a lower side of a package base and to make heat generated from a semiconductor element escape to a heat sink effectively by bonding a heat transmitting substrate composed of a material of high heat conductivity to a lower side of the package base of an insulator wherein the semiconductor element is mounted on a central recessed bottom part thereof with a metallic brazing material. CONSTITUTION:A heat transmitting substrate 8 is attached to a rear of an alumina ceramic package base 1; the attaching side of the substrate 8 is burnt after tungsten metallize is printed, and a brazing side whereto nickel plating is applied is formed, an outer terminal 2, a seal ring 3 and a heat transmitting substrate 8 of high heat conductivity are brazed by an Ag/Cu brazing material 9, and nickel plating and gold plating are further applied thereto. Then, a semiconductor element 4 is sealed to a bottom part of a recessed part of a case with an An/Si brazing material, a wire 5 is connected between an element electrode and a wiring pattern, and a nickel/clad cover cap 6 is welded to the seal ring 3 for airtight sealing. An upper side of a case side wall part in a circumference of an opening of the recessed part is bonded to an aluminum heat sink 7 with thermosetting epoxy resin adhesive. |
