POLYIMID-ZUSAMMENSETZUNG UND DAMIT HERGESTELLTES PREPREG UND LAMINAT

摘要

A polyimide composition is prepared with a polyimide containing minute hollow spherules made of a glass of a hydroxyl group content and having less than 0.5 mg/m2. A multilayer substrate for printed-wiring is prepared with this polyimide composition. The substrate possesses a low dielectric constant, dielectric dissipation factor and thermal expansion coefficient.