| 摘要 |
A multilayered circuit board according to the present invention includes at least first and second stacked insulating layers. The first insulating layer has thereon a first electric conductor made of a conductive film constituting an inductor and a first electrode made of a conductive film constituting a capacitor. The second insulating layer has thereon a second electrode made of a conductive film constituting a capacitor. The first and second insulating layers are stacked such that the first and second electrodes are opposed to each other through the insulating layers. Therefore this provides a circuit board having a capacitor and an inductor through the use of the two insulating layers, thus providing an inexpensive thin circuit board with small parts count and high work-efficiency compared with the use of three insulating layers in a related art.
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