| 摘要 |
PURPOSE:To solve the aligning labor of LED chips and, at the same time, facilitate the electrical connection between the chips and thin driving circuits by a method wherein all the LEDs of an LED head are composed of one chip. CONSTITUTION:By employing a plurality of LEDs 32 having the length and breadth of about 10mum, all of 2,400 LEDs are produced through a GaAs substrate 31 on a Si substrate 33 having the breadth of about 30mm or smaller than that of a photosensitive body (the vertical breadth of size A4 or 210mm). In addition, on the Si substrate 33, a peripheral circuit including the driving circuit of transistors 34 and the like are integrally formed so as to produce an LED head chip 21, the light of which is enlarged with a lens so as to form images on a photosensitive body. |
