Method for manufacturing thermoplastic resin molded semiconductor

摘要

A semiconductor assembly is sandwiched by two metal molds so that the semiconductor assembly is located within a cavity formed between the metal molds. Thermoplastic resin is injected through an injection stream passage provided in one of the metal molds and directly leading to the cavity therein. Resin in the injection stream passage within one of the metal molds is heated to a temperature higher than a melting point of the themoplastic resin. The thermoplastic resin injected into the cavity is cooled by the metal molds to be hardened.