发明名称 |
Method for mounting electronic component on a flexible printed circuit board |
摘要 |
<p>The invention concerns a method for mounting electronic components and a related flexible printed circuit board. This board is constituted with a first insulation film (1) covering a first insulating resist layer (3), a second insulation film (7) covering a second insulating resist layer (6) and a printed circuit (4) formed between the first insulating resist layer (3) and the second insulating resist layer (6), and a terminal (5a) of an electronic component (5) is disposed on the printed circuit (4), and the second insulation film (7) is pressed and heated. <IMAGE></p> |
申请公布号 |
EP0622980(B1) |
申请公布日期 |
1997.07.09 |
申请号 |
EP19940106414 |
申请日期 |
1994.04.25 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
TANABE, KOUJI;NISHIOKA, NAOHIRO |
分类号 |
H05K3/28;H05K1/00;H05K1/09;H05K1/11;H05K1/18;H05K3/24;H05K3/32;H05K3/40;H05K3/46;(IPC1-7):H05K3/32 |
主分类号 |
H05K3/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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