| 摘要 |
PROBLEM TO BE SOLVED: To prevent conductive adhesive agent from protruding to an electrode pad of a semiconductor element. SOLUTION: In this semiconductor device, a plurality of electrodes on the upper surface of a semiconductor carrier 4 are connected with Au bumps 2 on a semiconductor element 3 via conductive adhesive agent 6, and a space between the semiconductor element 3 and the semiconductor carrier 4 and peripheral end parts are filled and covered with sealing resin 7. Since the Au bumps 2 are formed on rectangular electrode pads 12 wherein the length of long sides are greater about 20% than the short sides, the conductive adhesive agent 6 does not protrude to an adjacent electrode pad 12, and imperfect connection can be eliminated, when the Au bumps 2 are bonded to the electrodes 5 of the semiconductor carrier 4 by using the conductive adhesive agent 6. |
