| 摘要 |
<p>A test fixture is interposed between a performance board (62) and a socket board (10) to carry out high-density transmission of high-frequency signals. In such a structure of test fixture interface, the thermal conduction from IC sockets (11) on the socket board to a connector board is restricted, and IC sockets (11) are arranged flat on the socket board. A socket board on a test handler side is provided with a surface mount connector, and a connector board for transmitting signals from one end of the board to the other end is provided with a connector that can be engaged with the surface mount connector.</p> |
