| 摘要 |
A bump-height measuring apparatus for measuring heights of projecting bumps formed on a surface of a work comprises a holding section for holding the work and relatively positioning the work, an illuminating section for emitting light from two positions onto that region of the work held by the holding section, in which bumps to be measured in height are located, such that the bumps project shadows on the work, the two positions being opposite to each other, and each of the positions being located at a predetermined elevation angle with respect to the region, an imaging section for imaging the region onto which the light is emitted from the two positions in the illuminating step, and outputting image signals producing images including shadow images of the bumps, the shadows of each of the bumps extending in two directions, respectively, a shadow extracting section for extracting the shadow images from the images produced by the image signals output from the imaging section, and then outputting binary image signals producing the shadow images, and an arithmetic section for determining lengths between distal ends of the shadow images of the bumps on the basis of the binary image signals output from the shadow extracting section, and then determining heights of the bumps on the basis of the determined lengths and the elevation angle.
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