发明名称 HIGH-FREQUENCY CIRCUIT
摘要 PROBLEM TO BE SOLVED: To effectively eliminate unwanted frequency components in a high frequency by easily adjusting an electric characteristic of an open stub, without directly changing a physical length of a microstrip line forming the stub. SOLUTION: Component pads 22a, 22b, 22c, 22d and component pads 23a, 23b, 23c, 23d on which components are mounted are provided or mount regions 22, 23 that are extended for mount of components freely and optionally are provided onto a microstrip line forming stubs 13, 31. A coupling capacitor 21 is mounted on the components pads 22a, 22b, 22c, 22d, 23a, 23b, 23c, 23d and electrical characteristics of the open stub 12 is adjusted depending on the mount position of the capacitor 21, so as to absorb dispersion in the case of manufacture of a board to eliminated effectively undesired frequency components of the high frequency signal.
申请公布号 JP2000183610(A) 申请公布日期 2000.06.30
申请号 JP19980360826 申请日期 1998.12.18
申请人 SONY CORP 发明人 SAKUSABE KENICHI
分类号 H01P3/08;H01P5/02 主分类号 H01P3/08
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