| 摘要 |
PROBLEM TO BE SOLVED: To prevent the warpage of a semiconductor device caused by synthetic resin sealing. SOLUTION: On a chip substrate 2 made of a synthetic resin, a plurality of semiconductor chips 4 are mutually bonded and fixed at intervals. On the chip substrate 2 around at least each semiconductor chip 4, a synthetic resin 18 that is heated for fluidizing is filled. After the filled synthetic resin 18 is cooled for curing, the synthetic resin 18 and the chip substrate 2 are cut between adjacent semiconductor chips 4 for obtaining each semiconductor device 20. At that time, on a region on the chip substrate 2 other than a place where the semiconductor chip 4 is fixed, an invar plate 12 where a coefficient of thermal expansion is small or negative is extended for bonding and fixing to the chip substrate 2 in advance. The synthetic resin 18 after the curing and chip substrate 2 is cut so that the plate 12 is not included in each semiconductor device 20.
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