发明名称 |
Semiconductor device and method of making the same |
摘要 |
A semiconductor device includes a first lead having an inner portion on which a semiconductor chip is mounted, a second lead having an inner portion electrically connected to the semiconductor chip via a wire and a resin package for sealing the semiconductor chip and the wire. The inner portions, the semiconductor chip and the wire are coated with a coating film formed of amorphous fluororesin.
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申请公布号 |
US2002093081(A1) |
申请公布日期 |
2002.07.18 |
申请号 |
US20020043898 |
申请日期 |
2002.01.11 |
申请人 |
ROHM CO., LTD. |
发明人 |
UEDA TAKASHI;ISOGAWA KIYOHIRO |
分类号 |
H01L23/28;H01L23/31;H01L23/48;H01L31/0203;H01L33/44;H01L33/56;H01L33/62;(IPC1-7):H01L23/02 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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