发明名称 UNCHARGED ADHESIVE FILM AND ELECTRONIC PARTS TRANSPORTATION BODY USING IT
摘要 PROBLEM TO BE SOLVED: To provide an electronic parts transportation body, in which electronic parts are difficult to stick to a cover film covering holes in which the electronic parts are housed, so that the electronic parts are provided on site in a stable manner. SOLUTION: An uncharged adhesive film is manufactured, which comprises a support layer 11, and a seal layer 13 which has a charge prevention characteristics and whose seal surface is subjected to either or both ozone process or/and corona discharge process. The electronic parts transportation body is manufactured using the above manufactured film.
申请公布号 JP2002321788(A) 申请公布日期 2002.11.05
申请号 JP20010124895 申请日期 2001.04.23
申请人 SHOWA DENKO PACKAGING CO LTD 发明人 FURUICHI KOJI;KISAKA JUN;SASAKI YASUYUKI
分类号 B65D73/02;B32B7/02;B65D85/86;C09J7/02;C09J123/00;(IPC1-7):B65D85/86 主分类号 B65D73/02
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