发明名称 |
UNCHARGED ADHESIVE FILM AND ELECTRONIC PARTS TRANSPORTATION BODY USING IT |
摘要 |
PROBLEM TO BE SOLVED: To provide an electronic parts transportation body, in which electronic parts are difficult to stick to a cover film covering holes in which the electronic parts are housed, so that the electronic parts are provided on site in a stable manner. SOLUTION: An uncharged adhesive film is manufactured, which comprises a support layer 11, and a seal layer 13 which has a charge prevention characteristics and whose seal surface is subjected to either or both ozone process or/and corona discharge process. The electronic parts transportation body is manufactured using the above manufactured film.
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申请公布号 |
JP2002321788(A) |
申请公布日期 |
2002.11.05 |
申请号 |
JP20010124895 |
申请日期 |
2001.04.23 |
申请人 |
SHOWA DENKO PACKAGING CO LTD |
发明人 |
FURUICHI KOJI;KISAKA JUN;SASAKI YASUYUKI |
分类号 |
B65D73/02;B32B7/02;B65D85/86;C09J7/02;C09J123/00;(IPC1-7):B65D85/86 |
主分类号 |
B65D73/02 |
代理机构 |
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主权项 |
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地址 |
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