SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To facilitate precise positioning of a semiconductor chip in a bonding position or appearance inspection after positioning. SOLUTION: In a semiconductor integrated circuit device wherein the outside dimensions of a die pad 3 as chip placement portion are larger than the outside dimensions of the semiconductor chip 2, V-grooves (or projections) 22 are formed on part of suspending leads 4 for supporting the die pad at equal intervals. The V-grooves 22 are used as graduations during positioning or appearance inspection. Precise positioning of the semiconductor chip 2 or appearance inspection in an appearance inspection process subsequent to positioning is carried out by making good use of the V-grooves 22.