发明名称 THERMOCONDUCTIVE SILICONE COMPOSITION AND SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a thermoconductive silicone composition having high thermal conductivity and losing no flexibility even if exposed to heat for a long period of time. SOLUTION: This thermoconductive silicone composition comprises (A) an organopolysiloxane having in one molecule at least two alkenyl groups, (B) an organohydrogenpolysiloxane having SiH group on the side chain, (C) an organohydrogenpolysiloxane having SiH group on the end, (D) a filler as a combination of aluminum powder with zinc oxide powder in the weight ratio of the former to the latter of 1-10, (E) a catalyst selected from the group consisting of platinum and platinum compounds and (F) a control agent for suppressing the catalytic activity of the component E; wherein the ratio C/B is such as to be 1.0-10.0 in the ratio of [the number of the component C-derived SiH groups] to [the number of the component B-derived SiH groups]. This silicone composition is characterized by having a viscosity of 50-1,000 Pa.s at 25 deg.C.
申请公布号 JP2002327116(A) 申请公布日期 2002.11.15
申请号 JP20010133895 申请日期 2001.05.01
申请人 SHIN ETSU CHEM CO LTD 发明人 YAMADA KUNIHIRO;ISOBE KENICHI
分类号 C08L83/07;C08K3/08;C08K3/22;C08K5/5415;C08K5/5419;C08L83/04;C08L83/05;H01L23/36;H01L23/373 主分类号 C08L83/07
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