发明名称 MOLD CLAMPING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a mold clamping device capable of reducing the effect caused by the magnetic field leaked to the circumference from a mold clamping electromagnet. SOLUTION: The mold clamping device has an electromagnet holding member for holding the electromagnet and the attraction plate opposed to the electromagnet holding member to attract the electromagnet holding member by the electromagnet and transmitting its attraction force as mold clamping force. A magnetic element shielding member is arranged so as to cover the circumference of the gap formed between the electromagnet holding member and the attraction plate. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008044318(A) 申请公布日期 2008.02.28
申请号 JP20060224451 申请日期 2006.08.21
申请人 SUMITOMO HEAVY IND LTD 发明人 MORITA HIROSHI;MORIYA KOJI;ANDO MANABU;YAMAMOTO TAIZO
分类号 B29C45/64;B29C33/20 主分类号 B29C45/64
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