摘要 |
PROBLEM TO BE SOLVED: To provide a mold clamping device capable of reducing the effect caused by the magnetic field leaked to the circumference from a mold clamping electromagnet. SOLUTION: The mold clamping device has an electromagnet holding member for holding the electromagnet and the attraction plate opposed to the electromagnet holding member to attract the electromagnet holding member by the electromagnet and transmitting its attraction force as mold clamping force. A magnetic element shielding member is arranged so as to cover the circumference of the gap formed between the electromagnet holding member and the attraction plate. COPYRIGHT: (C)2008,JPO&INPIT
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