| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate dividing method capable of reducing the number of scannings of laser beams. <P>SOLUTION: When dividing a division object substrate 4 by emitting the laser beams from the thickness direction of the division object substrate 4 to the division object substrate 4 of a TFT element substrate or the like, the energy of the laser beams is condensed over the whole area or almost the whole area in the thickness direction of the division object substrate 4 by diffracting the laser beams with a diffraction optical element 13 and a modified area 1 is formed in a condensing area. Accordingly, sufficient energy density is obtained by the long thin condensing area suitable for substrate division and the modified area 1 over the whole area or almost the whole area in the thickness direction of the division object substrate 4 is formed, so that the number of the scannings of the laser beams is reduced. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
