| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive paste in which there is no occurrence of gas generation or swelling accompanied with that, and in which interlayer connection of high reliability can be achieved. SOLUTION: The conductive paste contains a conductive metal material and a resin material. As the conductive metal material, a high melting point metal and a low melting point metal are contained, and Sn is contained as the low melting point metal. As the resin material, a thermoplastic phenoxy resin is contained. As a solvent, triethyleneglycol dimethyl ether is contained. The content of Sn is 30 wt.% to 60 wt.% of the whole conductive metal material. COPYRIGHT: (C)2009,JPO&INPIT |
