| 摘要 |
PROBLEM TO BE SOLVED: To provide a residue-less flux which can be used in a manufacturing method for curing an under-fill material after cooling is performed up to about 110°C and an under-fill material is filled at such a temperature without performing cooling up to room temperature after soldering.SOLUTION: A non-washing flux used in a semi-conductor packaging process in which the non-washing flux is applied at a room temperature between a solder bump formed on a semiconductor chip and wiring plated with solder formed on a substrate, the solder bump and the wiring are soldered, thereafter, are cooled to 100 to 120°C and are retained at such a temperature as it is, under-fill material is filled between the semiconductor chip and the substrate and, thereafter, the under-fill material is cured, contains a solvent (A) having a temperature of 160 to 210°C at which mass decreases to 50% according to thermogravimetric analysis and a dicarboxylic acid or a tricarboxylic acid (B) having a temperature of 190 to 320°C at which mass decreases to 50%. Therein, the non-washing flux contains a component (B) by 0.3 to 3.0 pts.mass for 100 pts.mass of the non-washing flux.SELECTED DRAWING: Figure 2 |
