| 发明名称 | Tape package and display apparatus including the same | ||
| 摘要 | A tape package includes a base substrate including a signal transmitting area and a protruding area protruded from the signal transmitting area, an integrated circuit chip mounted on the base substrate, and a lead line disposed on the base substrate and including a first portion electrically connected with the integrated circuit chip, a second portion electrically connected with the first portion and extending in a first direction, and a third portion electrically connected with the second portion and extending in a second direction crossing the first direction. | ||
| 申请公布号 | US9398686(B2) | 申请公布日期 | 2016.07.19 |
| 申请号 | US201414454850 | 申请日期 | 2014.08.08 |
| 申请人 | SAMSUNG DISPLAY CO., LTD. | 发明人 | Shin Ki-Hae;Go Jeong-Hun;Ku Hee-Un;Kim Young-Sun;Na Hoe-Seok |
| 分类号 | H05K1/11;H05K1/02;H05K3/36;H01L23/498;H05K1/18;H05K3/28;H05K3/32 | 主分类号 | H05K1/11 |
| 代理机构 | Cantor Colburn LLP | 代理人 | Cantor Colburn LLP |
| 主权项 | 1. A tape package comprising: a base substrate comprising a signal transmitting area, and a protruding area protruded from the signal transmitting area; an integrated circuit chip mounted on the base substrate; and a lead line disposed on the base substrate and comprising: a first portion electrically connected with the integrated circuit chip;a second portion electrically connected with the first portion and extending in a first direction; anda third portion electrically connected with the second portion and extending in a second direction crossing the first direction. | ||
| 地址 | KR | ||