发明名称 貼付装置
摘要 PROBLEM TO BE SOLVED: To provide a pasting apparatus having a cutting mechanism which has a simple configuration and is capable of cutting a label without a mount and coping with a peeling specification.SOLUTION: A pasting apparatus 1 includes: a printing mechanism 32 which prints a mount-less label L, with an adhesive layer exposed on the back surface of a substrate, and carries to the downstream; a cutting mechanism 8 cutting the mount-less label to label pieces LA; and a pasting mechanism 2 which has a suction pad 5 that waits in the proximity of the cutting mechanism, sucks and holds the label pieces and moves, and is used to paste the label pieces to a to-be-pasted object. The cutting mechanism includes a fixed blade 3 provided in the downstream of the printing mechanism and a movable blade 7 formed on one side opposite to the fixed blade. The mount-less labels are cut to single-leaf label pieces LA by moving the suction pad through the pasting mechanism to make the fixed and movable blades engaged with each other, and the label pieces are moved as being sucked and held on the suction pad through the pasting mechanism and pasted to the object.
申请公布号 JP5986235(B2) 申请公布日期 2016.09.06
申请号 JP20150005644 申请日期 2015.01.15
申请人 サトーホールディングス株式会社 发明人 佐々木 哲也
分类号 B65C9/18 主分类号 B65C9/18
代理机构 代理人
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