| 发明名称 | Clamping structure, electronic device and clamping component | ||
| 摘要 | A clamping structure includes an object, a clamping component and an elastic component. The object has a hole and a containing space, wherein the containing space is connected to the hole. The clamping component includes a pillar, a bump and a head portion, wherein the bump and the head portion are connected to the pillar, and the pillar is adapted to be inserted into the hole and rotated such that the bump moves to the containing space. When the bump is located in the containing space, the elastic component is compressed between the object and the head portion, and the bump is positioned at the containing space by elastic force of the elastic component, such that the clamping component is fastened to the object. | ||
| 申请公布号 | US9448585(B2) | 申请公布日期 | 2016.09.20 |
| 申请号 | US201414325384 | 申请日期 | 2014.07.08 |
| 申请人 | Wistron Corporation | 发明人 | Cheng Jui-Kai;Yu Chia-Lin;Lin Ju-Ching;Tzeng Ya-Jiun;Yang Chu-Ting |
| 分类号 | H05K5/06;G06F1/16;H05K5/02;H05K5/00;H05K5/03 | 主分类号 | H05K5/06 |
| 代理机构 | Jianq Chyun IP Office | 代理人 | Jianq Chyun IP Office |
| 主权项 | 1. A clamping structure, adapted to an electronic device, the clamping structure comprising: an object having a hole and a containing space, wherein the containing space is connected to the hole; a clamping component comprising a pillar, a bump and a head portion, wherein the bump and the head portion are connected to the pillar, and the pillar is adapted to be inserted into the hole and rotated such that the bump moves to the containing space; and an elastic component, wherein when the bump is located in the containing space, the elastic component is compressed between the object and the head portion, and the bump is positioned at the containing space by elastic force of the elastic component, such that the clamping component is fastened to the object. | ||
| 地址 | New Taipei TW | ||