发明名称 Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same
摘要 An apparatus to test a semiconductive device includes a base plane that holds at least one heat-transfer fluid unit cell. The at least one heat-transfer fluid unit cell includes a fluid supply structure including a supply-orifice cross section as well as a fluid return structure including a return-orifice cross section. The supply-orifice cross section is greater than the return-orifice cross section. A die interface is also included to be a liquid-impermeable material.
申请公布号 US9448278(B2) 申请公布日期 2016.09.20
申请号 US201514746764 申请日期 2015.06.22
申请人 INTEL CORPORATION 发明人 Schroeder Christopher R.;Ackerman Christopher W.;Shipley James C.;Acikalin Tolga;Sauciuc Ioan;Rutigliano Michael L.;Maveety James G.;Gupta Ashish
分类号 G01R31/28;G01R31/26;G06F1/20;H01L23/473;H01L23/467;F28F3/12 主分类号 G01R31/28
代理机构 Konrad Raynes Davda & Victor LLP 代理人 Konrad Raynes Davda & Victor LLP ;Raynes Alan S.
主权项 1. An apparatus including a direct fluid-contact thermal block to temperature-control a semiconductive device, comprising: a first laminate type including a plurality of unit block perimeters; a base plane second laminate type, wherein the base plane second laminate type includes at least one heat-transfer fluid unit cell, the at least one heat-transfer fluid unit cell including: a fluid supply structure including a supply-orifice cross-sectional area; anda fluid return structure including a return-orifice cross-sectional area, wherein the supply-orifice cross-sectional area is greater than the return-orifice cross-sectional area; a third laminate type including fluid-supply distributors coupled to the fluid supply structure, and fluid-return collectors coupled to the fluid return structure; a fourth laminate type including fluid supply- and return routers, respectively, that couple to the respective fluid supply- and return distributors and collectors; a fifth laminate type includes fluid supply- and return plenums, respectively, that couple to the respective fluid supply- and return routers; and a sixth laminate type including a top plane of the direct fluid-contact thermal block and including supply-fluid inlets and return-fluid outlets, respectively, that are coupled to the respective fluid supply- and return plenums; wherein the first laminate type is 5 mils (thousandths of an inch) thick and is a single layer; the base plane second laminate type includes a fluid-flow array of 120 unit cells defined by a 24 unit-cell dimension along an X-axis and a five unit-cell dimension along a Y-axis, and wherein the base plane second laminate type is 5 mils thick and includes a total of 4 layers; the third laminate type is 10 mils thick and includes a total of nine layers; the fourth laminate type is 10 mils thick and includes a total of nine layers; the fifth laminate type is 10 mils thick and includes a total of five layers; and the sixth laminate type is 10 mils thick and includes a total of two layers.
地址 Santa Clara CA US