发明名称 TUNABLE VOLTAGE MARGIN ACCESS DIODES
摘要 The present invention relates generally to high current density access devices (ADs), and more particularly, to a structure and method of forming tunable voltage margin access diodes in phase change memory (PCM) blocks using layers of copper-containing mixed ionic-electronic conduction (MIEC) materials. Embodiments of the present invention may use layers MIEC material to form an access device that can supply high current-densities and operate reliably while being fabricated at temperatures that are compatible with standard BEOL processing. By varying the deposition technique and amount of MIEC material used, the voltage margin (i.e. the voltage at which the device turns on and the current is above the noise floor) of the access device may be tuned to specific operating conditions of different memory devices.
申请公布号 US2016284995(A1) 申请公布日期 2016.09.29
申请号 US201615132675 申请日期 2016.04.19
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 Bajaj Mohit;Deb Arpan K.;Konar Aniruddha;Murali Kota V. R. M.;Pandey Rajan K.;Virwani Kumar R.
分类号 H01L45/00 主分类号 H01L45/00
代理机构 代理人
主权项 1. A method comprising: forming a mixed ionic-electronic conduction (MIEC) layer directly on a carbon doped silicon germanium substrate, the MIEC layer comprising three individual layers of molybdenum disulfide stacked one on top of another, wherein each layer of molybdenum disulfide comprises two hexagonal planes of sulfur atoms separated by one hexagonal plane of molybdenum atoms; doping the MIEC layer with interstitial chromium atoms using an ion implantation technique to achieve a concentration of approximately 8%; patterning the doped MIEC layer into multiple ribbons each having an approximate width of 1 nm; forming a first titanium electrode at a first end of the ribbons, a bottom surface of the first titanium electrode is in direct contact with a top surface of the MIEC layer ; and forming a second titanium electrode at a second end of the ribbons such that current flows horizontally from the first titanium electrode to the second titanium electrode and through the MIEC layer, a bottom surface of the second titanium electrode is in direct contact with a top surface of the MIEC layer.
地址 ARMONK NY US