发明名称 SEMICONDUCTOR MODULE
摘要 The invention relates to a semiconductor module (1) having a 1st potential (11), a 2nd potential (12) and a 3rd potential (13), wherein a series circuit comprising a 1st and a 2nd power semiconductor (21, 22) is arranged between the 1st potential (11) and the 2nd potential (12), wherein a connecting point between the 1st and 2nd power semiconductors (21, 22) represents the 3rd potential (13), the potentials (11, 12, 13) each being electrically connected to at least one connection. To improve performance, it is proposed that the connections be configured such that the connection for the 3rd potential (13) is designed for an RMS current (Ieff(AC)) that corresponds to 1.3 to 1.5 times the value of the RMS current (Ieff(DC+), Ieff(DC-)) from the connection for the 1st or the 2nd potential (11, 12). The invention further relates to a converter (2) having such a semiconductor module (1) and to a vehicle, particularly a rail vehicle, having such a converter (2).
申请公布号 WO2016180546(A1) 申请公布日期 2016.11.17
申请号 WO2016EP52777 申请日期 2016.02.10
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 KRAFFT, Eberhard Ulrich;LASKA, Bernd;NAGEL, Andreas;WEIGEL, Jan
分类号 H02M7/00;H01L25/16;H02M5/458 主分类号 H02M7/00
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