Clock tree synthesis for low cost pre-bond testing of 3D integrated circuits

摘要

To enable low cost pre-bond testing for a three-dimensional (3D) integrated circuit, a backbone die may have a fully connected two-dimensional (2D) clock tree and one or more non-backbone die may have multiple isolated 2D clock trees. In various embodiments, clock sinks on the backbone die and the non-backbone die can be connected using multiple through-silicon-vias and the isolated 2D clock trees in the non-backbone die can be further connected via a Detachable tree (D-tree), which may comprise a rectilinear minimum spanning tree representing a shortest interconnect among the sinks associated with the 2D clock trees in the non-backbone die. Accordingly, the backbone die and the non-backbone die can be separated and individually tested prior to bonding using one clock probe pad, and the D-tree may be easily removed from the non-backbone die subsequent to the pre-bond testing by burning fuses at the sinks associated with the 2D clock trees.

主权项

1. A method for pre-bond testing a three-dimensional integrated circuit, comprising:
building a fully connected two-dimensional (2D) clock tree on a backbone die; building multiple isolated 2D clock trees on one or more non-backbone die, wherein multiple through-silicon-vias connect the 2D clock tree in the backbone die and the multiple isolated 2D clock trees in the one or more non-backbone die; and connecting the multiple isolated 2D clock trees in the one or more non-backbone die using a Detachable tree (D-tree), wherein the D-tree comprises a root node and fuses located at sinks associated with the isolated 2D clock trees.