Thermal management of tightly integrated semiconductor device, system and/or package

摘要

Some implementations provide a package that includes a first die and a second die adjacent to the first die. The second die is capable of heating the first die. The package also includes a leakage sensor configured to measure a leakage current of the first die. The package also includes a thermal management unit coupled to the leakage sensor. The thermal management unit configured to control a temperature of the first die based on the leakage current of the first die.

主权项

1. A package comprising:
a first die, wherein the first die is an integrated circuit (IC); a second die adjacent to the first die, the second die capable of heating the first die; a first plurality of through substrate vias (TSVs) configured to couple the first die to the second die; a leakage sensor configured to measure a leakage current of the first die; and a thermal management unit configured to couple to the leakage sensor, the thermal management unit configured to control a temperature of the first die based on the leakage current of the first die.