INTERDIGITIZED POLYSYMMETRIC FANOUTS, AND ASSOCIATED SYSTEMS AND METHODS

摘要

Systems and methods for testing semiconductor wafers using a wafer translator are disclosed herein. In one embodiment, an apparatus for testing semiconductor dies includes a wafer translator having a wafer-side facing the dies and an inquiry-side facing away from the wafer-side. The inquiry-side of the wafer translator carries a first and a second plurality of inquiry-side contact structures. The first plurality of the inquiry-side contact structures is interleaved with the second plurality of the inquiry-side contact structures.