| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for efficiently obtaining a wiring board, in which a dielectric layer made of a polymer material and a conductive layer are alternately laminated, without having core materials. <P>SOLUTION: The following processes are performed, in this order, namely, a covering process for covering the first main surface MP1 of a metal plate 2 used as a support substrate for reinforcement in manufacture with a metal thin-film layer 3 having selective etching properties to the metal plate 2; a lamination process for forming a conductive pattern 11 for forming a metal terminal pad on the first main surface MP2 of the metal thin-film layer 3, and forming a wiring laminated section 10, by alternately laminating the dielectric layer made of a polymer material and the metal conductive layer, after the covering process; and an etching process for removing the metal plate 2 by selective etching, removing the metal thin-film layer 3 by selective etching, and exposing a conductive pattern 11 formed at the side of the first main surface MP2 of the metal thin-film layer 3, after the lamination process. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
