| 摘要 |
PURPOSE:To improve the reliability of a semiconductor element after being sealed with resin mold by a method wherein conductive patterns are provided in a package consisting of the semiconductor element and the insulation resin covering it and one end of each conductive pattern is connected to the electrode pad of the semiconductor element and the other end is exposed on the surface of the package. CONSTITUTION:A semiconductor element 1 such as a transistor, IC or LSI is packed in a package 3 made of insulation resin and lead electrode 4 are provided in the package 3. One end of each lead electrode 4 contacts the electrode pad of the semiconductor element 1 and the other end is exposed out of the main surface of the package 3. The exposed ends of the lead electrodes 4 are arranged along the circumference of the main surface of the package 3. The semiconductor element 1 may be either a bare chip or a chip coated with a protective film made of polyimide resin, epoxy resin, silicone resin or the like. |
