Heat-curable type resinous composition and moulded article prepared therefrom.

摘要

A heat curable resinous composition comprises: (a) a polyisocyanate component comprising at least one bi- to hexa-functional polyisocyanate compound; and (b) a polyepoxide component comprising at least one bi- to hexa-functional polyepoxide compound; together with a catalyst system comprising (i) a complex of an organo antimony halide and an organo tin halide and/or a complex of an organo antimony halide and a zinc halide or (ii) a precursor system for said complex comprising an organo antimony halide together with an organo tin halide and/or a zinc halide; the said catalyst system being separate from components (a) and (b) or present in one or both of said components (a) and (b).