发明名称 THERMOSETTING RESIN COMPOSITION FOR IN-MOLD COATING MOLDING AND COATED MOLDED PRODUCT
摘要 PURPOSE:To obtain a coated molded product excellent in the adhesion of a coating layer formed using a thermosetting resin composition for in-mold coating molding as a base material. CONSTITUTION:A thermosetting resin composition is obtained by adding at least one kind of a compound selected from an unsaturated carboxilic acid (anhydride) monomer and a metal salt thereof to a resin component containing a thermosetting resin and used as a base material to obtain a coated molded product.
申请公布号 JPH0584759(A) 申请公布日期 1993.04.06
申请号 JP19910251650 申请日期 1991.09.30
申请人 SEKISUI CHEM CO LTD 发明人 MORISHITA NATSUKI;YAMAMOTO KAZUYOSHI
分类号 B29C43/18;B29C43/20;B29C70/06;B29K101/10;B29K105/06;C08F283/01;C08F299/04;C08J7/04 主分类号 B29C43/18
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