发明名称 |
THERMOSETTING RESIN COMPOSITION FOR IN-MOLD COATING MOLDING AND COATED MOLDED PRODUCT |
摘要 |
PURPOSE:To obtain a coated molded product excellent in the adhesion of a coating layer formed using a thermosetting resin composition for in-mold coating molding as a base material. CONSTITUTION:A thermosetting resin composition is obtained by adding at least one kind of a compound selected from an unsaturated carboxilic acid (anhydride) monomer and a metal salt thereof to a resin component containing a thermosetting resin and used as a base material to obtain a coated molded product. |
申请公布号 |
JPH0584759(A) |
申请公布日期 |
1993.04.06 |
申请号 |
JP19910251650 |
申请日期 |
1991.09.30 |
申请人 |
SEKISUI CHEM CO LTD |
发明人 |
MORISHITA NATSUKI;YAMAMOTO KAZUYOSHI |
分类号 |
B29C43/18;B29C43/20;B29C70/06;B29K101/10;B29K105/06;C08F283/01;C08F299/04;C08J7/04 |
主分类号 |
B29C43/18 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|