| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor wafer polishing state identifying apparatus, semiconductor wafer polishing apparatus, and semiconductor wafer polishing method in which a state of a polishing pad can be directly measured, while polishing a semiconductor wafer. <P>SOLUTION: A polishing state identifying apparatus comprises: a prism 2 disposed to be abutted to a surface of a polishing pad 5; an optical fiber 1a for introducing a light, with which the surface is irradiated into the prism 2; an optical fiber 1b for deriving a light, which is reflected from the surface from the prism 2; and a photodetector 9 for detecting the reflected light. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
