SEMICONDUCTOR COMPONENT COMPRISING SYNTHETIC HOUSING MATERIAL, SEMICONDUCTOR CHIP AND CIRCUIT SUPPORT, AND METHOD FOR PRODUCING THE SAME

摘要

The invention relates to a semiconductor component (1) comprising a synthetic housing material (2), a semiconductor chip (3) and a circuit support (4). The semiconductor chip (3) is embedded in the synthetic housing material (2). The top surface of the semiconductor chip (3) and the synthetic housing material (2) are disposed on a circuit support (4). An elastic adhesive layer (11) is interposed between the circuit support (4) and the synthetic housing material (2) comprising the semiconductor chip (3), thereby mechanically decoupling an upper area from a lower area of the semiconductor component (1).