发明名称 MANUFACTURE OF PRINTED CIRCUIT BOARD
摘要 PURPOSE:To provide a method for manufacturing a printed circuit board in which the hard board of high quality to be selectively peeled and removed can be manufactured in a mass production and high yield without the necessity of a complicated step and a special facility. CONSTITUTION:A method for manufacturing a printed circuit board comprises the steps of laminating and integrating hard printed circuit boards 2, 2' having separating grooves 3a, 3b partly selectively cut and separated at predetermined positions through an adhesive layer on a main surface of a flexible board 1, and forming an outer layer circuit 2e on the hard boards 2, 2' by photoetching. When the circuit 2e is formed on the boards 2, 2' to be cut and removed by the grooves 3a, 3b, a disposable pattern 2f remains.
申请公布号 JPH06342981(A) 申请公布日期 1994.12.13
申请号 JP19930131723 申请日期 1993.06.02
申请人 TOSHIBA CORP 发明人 SHIBAYAMA KOICHIRO
分类号 H05K3/00;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/00
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