| 摘要 |
PURPOSE:To provide a method of mounting an electronic component, which does never generate an unsatisfactory state on appearance and operation which is accompanied by damage inflicted on the component, and moreover, can increase the adhesive strength of the component to a substrate for electronic component mounting by making uniform the thickness of a bonding agent. CONSTITUTION:A mounting substrate 2 with through holes 9 formed along the direction of the plate thickness of the substrate 2 is prepared for a mounting region part 4 to be mounted with an electronic component 1 on its surface. After a bonding agent 5 is applied on the surface of the region part 4, the component 1, which comes being transferred while being held by a vacuum suction head 6, is placed on the agent 5 and thereafter, the atmosphere opening operation of the head 6 is performed and almost simultaneously with this operation, the vacuum suction operation of the head 6 through holes 9 is performed to secure the component 1 on the surface of the region part 4. |
